Process-dependence of properties in high thermal conductivity aluminum nitride substrates for electronic packaging.

Process-dependence of properties in high thermal conductivity aluminum nitride substrates for electronic packaging.

Bibliographic Details
Main Author: Cooper, John H.
Other Authors: Dutta,Indranath
Language:en_US
Published: Monterey, California. Naval Postgraduate School 2013
Online Access:http://hdl.handle.net/10945/28470

Internet

http://hdl.handle.net/10945/28470

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