Intermetallic growth at the interface between copper and bismuth-tin solder
Approved for public release; distribution is unlimited. === Tin-bismuth alloys have been proposed as alternatives to lead containing solders for interconnection and packaging applications. Consequently, the interface between copper metallizations and bismuth-tin solders needs to be evaluated with re...
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| Language: | en_US |
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Monterey, California. Naval Postgraduate School
2014
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| Online Access: | http://hdl.handle.net/10945/40009 |