Studies on via coupling on multilayer printed circuit boards
Abstract Design and manufacturing techniques of printed circuit boards (PCB's) have advanced from early one or two-layer structures to the multilayer boards where ten or more layers are no longer uncommon. These give additional routing space, potential decrease in device size and various d...
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| Format: | Doctoral Thesis |
| Language: | English |
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University of Oulu
1999
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| Online Access: | http://urn.fi/urn:isbn:951425189X http://nbn-resolving.de/urn:isbn:951425189X |