Stress Analysis for Chip Scale Packages with Embedded Active Devices under Thermal Cycling
One of the main challenges in the electronics manufacturing and packaging development is how to integrate more functions inside the same or even smaller size. To meet the demand for higher integration, the interest toward passive and active component embedding has been increasing during the past few...
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| Format: | Others |
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PDXScholar
2014
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| Online Access: | http://pdxscholar.library.pdx.edu/open_access_etds/1782 http://pdxscholar.library.pdx.edu/cgi/viewcontent.cgi?article=2782&context=open_access_etds |