Constant Interface Temperature Reliability Assessment Method: An Alternative Method for Testing Thermal Interface Material in Products
As electronic packages and their thermal solutions become more complex the reliability margins in the thermal solutions diminish and become less tolerant to errors in reliability predictions. The current method of thermally stress testing thermal solutions can be over or under predicting end of life...
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| Format: | Others |
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PDXScholar
2015
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| Online Access: | https://pdxscholar.library.pdx.edu/open_access_etds/2295 https://pdxscholar.library.pdx.edu/cgi/viewcontent.cgi?article=3297&context=open_access_etds |