Stress Analysis of Embedded Devices Under Thermal Cycling
Embedded active and passive devices has been increasingly used by in order to integrate more functions inside the same or smaller size device and to meet the need for better electrical performance of the component assemblies. Solder joints have been used in the electronic industry as both structural...
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| Format: | Others |
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PDXScholar
2018
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| Online Access: | https://pdxscholar.library.pdx.edu/open_access_etds/4075 https://pdxscholar.library.pdx.edu/cgi/viewcontent.cgi?article=5085&context=open_access_etds |