Chemo-Thermo Cure of Viscoelastic Materials for Semiconductor Packaging Applications
Viscoelastic polymer materials are being actively considered as a novel material for semiconductor packaging applications as a result of their ability to develop strong adhesive bonds at lower temperatures. Viscoelastic thermoset materials are impacted by the stresses generated during the curing pro...
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| Format: | Others |
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PDXScholar
2018
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| Online Access: | https://pdxscholar.library.pdx.edu/open_access_etds/4537 https://pdxscholar.library.pdx.edu/cgi/viewcontent.cgi?article=5608&context=open_access_etds |