Nanoparticles removal in post-CMP (Chemical-Mechanical Polishing) cleaning
Research was performed to study the particle adhesion on the wafer surface after the chemical-mechanical polishing (CMP) process. The embedded particles can be abrasive particles from the slurry, debris from pad material, and particles of film being polished. Different methods of particle removal me...
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| Format: | Others |
| Language: | en_US |
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Texas A&M University
2006
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| Online Access: | http://hdl.handle.net/1969.1/4159 |