FAILURE PREDICTION AND STRESS ANALYSIS OF MICROCUTTING TOOLS
Miniaturized devices are the key producing next-generation microelectro-mechanical products. The applications extend to many fields that demand high-level tolerances from microproducts and component functional and structural integrity. Silicon-based products are limited because silicon is brittle. P...
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| Format: | Others |
| Language: | English |
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2010
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| Online Access: | http://hdl.handle.net/1969.1/ETD-TAMU-2009-05-788 |