Built-In Self Test (BIST) for Realistic Delay Defects
Testing of delay defects is necessary in deep submicron (DSM) technologies. High coverage delay tests produced by automatic test pattern generation (ATPG) can be applied during wafer and package tests, but are difficult to apply during the board test, due to limited chip access. Delay testing at the...
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| Format: | Others |
| Language: | en_US |
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2012
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| Online Access: | http://hdl.handle.net/1969.1/ETD-TAMU-2010-12-8923 |