Design and characterization of nanowire array as thermal interface material for electronics packaging
To allow electronic devices to operate within allowable temperatures, heat sinks and fans are employed to cool down computer chips. However, cooling performance is limited by air gaps between the computer chip and the heat sink, due to the fact that air is a poor heat conductor. To alleviate this pr...
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| Format: | Others |
| Language: | en_US |
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2010
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| Online Access: | http://hdl.handle.net/1969.1/ETD-TAMU-3188 http://hdl.handle.net/1969.1/ETD-TAMU-3188 |