Electrochemical Study of Under-Potential Deposition Processes on Transition Metal Surfaces
Copper under-potential deposition (UPD) on iridium was studied due to important implications it presents to the semiconductor industry. Copper UPD allows controlled superfilling on sub-micrometer trenches; iridium has characteristics to prevent copper interconnect penetration into the surrounding di...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | English |
| Published: |
University of North Texas
2006
|
| Subjects: | |
| Online Access: | https://digital.library.unt.edu/ark:/67531/metadc5372/ |