Passivation effects of surface iodine layer on tantalum for the electroless copper deposition.
The ability to passivate metallic surfaces under non-UHV conditions is not only of fundamental interests, but also of growing practical importance in catalysis and microelectronics. In this work, the passivation effect of a surface iodine layer on air-exposed Ta for the copper electroless deposition...
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| Format: | Others |
| Language: | English |
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University of North Texas
2004
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| Online Access: | https://digital.library.unt.edu/ark:/67531/metadc5546/ |