Passivation effects of surface iodine layer on tantalum for the electroless copper deposition.

• Main Author: Liu, Jian
• Other Authors: Kelber, Jeffry A.
• Format: Others
• Language: English
• Published: University of North Texas 2004
• Subjects: Passivity (Chemistry); Iodine.; Electroless plating.; Tantalum.; passivation; iodine; electroless; tantalum
• Online Access: https://digital.library.unt.edu/ark:/67531/metadc5546/

The ability to passivate metallic surfaces under non-UHV conditions is not only of fundamental interests, but also of growing practical importance in catalysis and microelectronics. In this work, the passivation effect of a surface iodine layer on air-exposed Ta for the copper electroless deposition was investigated by X-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM). Although the passivation effect was seriously weakened by the prolonged air exposure, iodine passivates the Ta substrate under brief air exposure conditions so that enhanced copper wetting and adhesion are observed on I-passivated Ta relative to the untreated surface.