The Effect of Plasma on Silicon Nitride, Oxynitride and Other Metals for Enhanced Epoxy Adhesion for Packaging Applications
The effects of direct plasma chemistries on carbon removal from silicon nitride (SiNx) and oxynitride (SiOxNy ) surfaces and Cu have been studied by x-photoelectron spectroscopy (XPS) and ex-situ contact angle measurements. The data indicate that O2,NH3 and He capacitively coupled plasmas are effec...
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| Format: | Others |
| Language: | English |
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University of North Texas
2014
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| Online Access: | https://digital.library.unt.edu/ark:/67531/metadc700040/ |