Study of Metal Whiskers Growth and Mitigation Technique Using Additive Manufacturing
For years, the alloy of choice for electroplating electronic components has been tin-lead (Sn-Pb) alloy. However, the legislation established in Europe on July 1, 2006, required significant lead (Pb) content reductions from electronic hardware due to its toxic nature. A popular alternative for coati...
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| Format: | Others |
| Language: | English |
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University of North Texas
2015
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| Online Access: | https://digital.library.unt.edu/ark:/67531/metadc804972/ |