Study and characetrization of plastic encapsulated packages for MEMS

Study and characetrization of plastic encapsulated packages for MEMS

Technological advancement has thrust MEMS design and fabrication into the forefront of modern technologies. It has become sufficiently self-sustained to allow mass production. The limiting factor which is stalling commercialization of MEMS is the packaging and device reliability. The challenging...

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Bibliographic Details
Main Author: Deshpande, Anjali W
Other Authors: John M. Sullivan, Jr., Committee Member
Format: Others
Published: Digital WPI 2005
Subjects:
finite difference methods
OEH methodology
packaging
plastic encapsulation
Fick's second law of diffusion
MEMS
Microelectromechanical systems
Microelectronic packaging
Plastics in packaging
Online Access:https://digitalcommons.wpi.edu/etd-theses/100
https://digitalcommons.wpi.edu/cgi/viewcontent.cgi?article=1099&context=etd-theses

Internet

https://digitalcommons.wpi.edu/etd-theses/100
https://digitalcommons.wpi.edu/cgi/viewcontent.cgi?article=1099&context=etd-theses

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