Generation of micro/nano hybrid surface structures on copper by femtosecond pulsed laser irradiation
The delamination of copper lead frames from epoxy molding compounds (EMC) is a severe problem for microelectronic devices, as it leads to reduced heat dissipation or circuit breakage. The micro/nanoscale surface structuring of copper is a promising method to improve the copper–EMC interfacial adhesi...
Main Authors: | , , |
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Format: | Article |
Language: | English |
Published: |
Springer Science and Business Media B.V.
2022
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Subjects: | |
Online Access: | View Fulltext in Publisher |