Generation of micro/nano hybrid surface structures on copper by femtosecond pulsed laser irradiation

The delamination of copper lead frames from epoxy molding compounds (EMC) is a severe problem for microelectronic devices, as it leads to reduced heat dissipation or circuit breakage. The micro/nanoscale surface structuring of copper is a promising method to improve the copper–EMC interfacial adhesi...

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Bibliographic Details
Main Authors: Nakajima, A. (Author), Omiya, M. (Author), Yan, J. (Author)
Format: Article
Language:English
Published: Springer Science and Business Media B.V. 2022
Subjects:
Online Access:View Fulltext in Publisher