Low-Power, Flexible Sensor Arrays with Solderless Board-to-Board Connectors for Monitoring Soil Deformation and Temperature

Low-Power, Flexible Sensor Arrays with Solderless Board-to-Board Connectors for Monitoring Soil Deformation and Temperature

Landslides are a global and frequent natural hazard, affecting many communities and infrastructure networks. Technological solutions are needed for long-term, large-scale condition monitoring of infrastructure earthworks or natural slopes. However, current instruments for slope stability monitoring...

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Bibliographic Details
Main Authors: Dafflon, B. (Author), Fiolleau, S. (Author), Uhlemann, S. (Author), Wielandt, S. (Author)
Format: Article
Language:English
Published: MDPI 2022
Subjects:
accelerometer
Accelerometers
Condition monitoring
Costs
Data handling
Deformation
Deformation measurements
deformation monitoring
Deformation monitoring
Depth-resolved
Flexible sensor array
Geotechnical
Geotechnical sensor
geotechnical sensors
Landslides
Low Power
Low power electronics
Printed circuit boards
Probes
Railroads
sensor arrays
Sensors array
Soil testing
Soils
Solderless connector
solderless connectors
Stability monitoring
Temperature measurement
Timing circuits
wireless sensor networks
Wireless sensor networks
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