Self-alignment of whole wafers using patterning for capillary forces
Three dimensional packaging schemes take advantage of multiple substrate materials, functionality, and reduced area constraints. Alignment of stacks of wafers becomes difficult as the number increases. We investigate full-wafer self-alignment as a means for solving this problem. To date, capillary s...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
AVS Science and Technology Society
2023
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| Subjects: | |
| Online Access: | View Fulltext in Publisher |