Robust Bottom-Up Gold Filling of Deep Trenches and Gratings

Robust Bottom-Up Gold Filling of Deep Trenches and Gratings

This work extends an extreme variant of superconformal Au electrodeposition to deeper device architectures while exploring factors that constrain its function and the robustness of void-free processing. The unconventional bottom-up process is used to fill diffraction gratings with trenches 94 μm dee...

Full description

Bibliographic Details
Main Authors: Josell, D. (Author), Miao, H. (Author), Osborn, W.A (Author), Williams, M.E (Author)
Format: Article
Language:English
Published: IOP Publishing Ltd 2022
Subjects:
Aspect ratio
Aspect-ratio
Bottom up
Bottom-up process
Deep gratings
Deep trench
Device architectures
Diffraction
Diffraction gratings
Electrolytes
Electroplating
Filling
Gold
Grating
Gratings
Sodium compounds
Superconformal
Visibility
Void-free
Online Access:View Fulltext in Publisher

Internet

View Fulltext in Publisher

Similar Items