Robust Bottom-Up Gold Filling of Deep Trenches and Gratings
This work extends an extreme variant of superconformal Au electrodeposition to deeper device architectures while exploring factors that constrain its function and the robustness of void-free processing. The unconventional bottom-up process is used to fill diffraction gratings with trenches 94 μm dee...
Main Authors: | Josell, D. (Author), Miao, H. (Author), Osborn, W.A (Author), Williams, M.E (Author) |
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Format: | Article |
Language: | English |
Published: |
IOP Publishing Ltd
2022
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Subjects: | |
Online Access: | View Fulltext in Publisher |
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