Evaluation of separating process for different materials by thermal stress cleaving technique
This paper aims to evaluate the separating process of brittle materials by thermal stress cleaving technique. This process is suitable for separating thin brittle materials such as sapphire and silicon wafer, which are sensitive to force. Both materials were used largely in mi-croelectronics, solar...
| Main Authors: | , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Science Publishing Corporation Inc
2018
|
| Subjects: | |
| Online Access: | View Fulltext in Publisher View in Scopus |