Effect of nanotopogranphy in direct wafer bonding: modeling and measurements
Nanotopography, which refers to surface height variations of tens to hundreds of nanometers that extend across millimeter-scale wavelengths, is a wafer geometry feature that may cause failure in direct wafer bonding processes. In this work, the nanotopography that is acceptable in direct bonding is...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
2005.
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| Subjects: | |
| Online Access: | Get fulltext |