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01544 am a22001813u 4500 |
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270883 |
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|a dc
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|a Qiao, X.
|e author
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|a Gao, N.
|e author
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|a Moktadir, Zakaria
|e author
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|a Michael, Kraft
|e author
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|a Starink, M.J.
|e author
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|a Fabrication of MEMS components using ultra fine grained aluminium
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|c 2010.
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|z Get fulltext
|u https://eprints.soton.ac.uk/270883/1/JMM_paper_to_Eprint.pdf
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|a A novel process for the fabrication of a microelectromechanical systems (MEMS) metallic component with features smaller than 10 µm and high thermal conductivity was investigated. This may be applied to new or improved microscale components, such as (micro-) heat exchangers. In the first stage of processing, equal channel angular pressing (ECAP) was employed to refine the grain size of commercial purity aluminium (Al-1050) to the ultrafine-grained (UFG) material. Embossing was conducted using a micro silicon mould fabricated by deep reactive ion etching (DRIE). Both cold embossing and hot embossing were performed on the coarse-grained and UFG Al-1050. Cold embossing on UFG Al-1050 led to a partially transferred pattern from the micro silicon mould and high failure rate of the mould. Hot embossing on UFG Al-1050 provided a smooth embossed surface with a fully transferred pattern and a low failure rate of the mould, while hot embossing on the coarse-grained Al-1050 resulted in a rougher surface with shear bands
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|a accepted_manuscript
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|a Article
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