Self-aligned silicidation of surround gate vertical MOSFETs for low cost RF applications

We report for the first time a CMOS-compatible silicidation technology for surround-gate vertical MOSFETs. The technology uses a double spacer comprising a polysilicon spacer for the surround gate and a nitride spacer for silicidation and is successfully integrated with a Fillet Local OXidation (FIL...

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Bibliographic Details
Main Authors: Hakim, M.M.A (Author), Tan, L. (Author), Abuelgasim, A. (Author), de Groot, C.H (Author), Redman-White, W. (Author), Hall, S. (Author), Ashburn, P. (Author)
Format: Article
Language:English
Published: 2010-12.
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