Stress in electroplated gold on silicon substrates and its dependence on cathode agitation
The influence of cathode agitation on the residual stress of electroplated gold has been investigated. Using a custom-built plating cell, a periodic, reciprocating motion was applied to silicon substrates that were electroplated with soft gold. A commercially available gold sulfite solution was used...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
2013-12.
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| Subjects: | |
| Online Access: | Get fulltext |