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  1. 1
    A Study of the Processing Properties of Hard-Particle Reinforced Composite Solders
    by Calderon, Jose Guadalupe
    Published 1994
    Subjects: “...Solder and soldering....”
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  2. 2
    Phenomenological modeling of the deformation behavior of solders
    by Scott, Daniel T.
    Published 2007
    Subjects: “...Solder and soldering...”
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  3. 3
    Cu6 Sn5 and Cu3 Sn intermetallics study in the Sn-40Pb/Cu system during long-term aging / Ramani Mayappan and Zainal Arifin Ahmad
    Subjects: “...Solder and soldering...”
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    Article
  4. 4
    A study of six weak organic acids commonly used in soldering fluxes
    by Smith, Brian Andrew
    Published 2008
    Subjects: “...Solder and soldering Testing...”
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  5. 5
    Study of polyarylene ether and its application in isotropically conductive adhesive
    by Liong, Silvia
    Published 2008
    Subjects: “...Solder and soldering...”
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  6. 6
    The Sn-3.5Ag-1.0Cu-0.1Zn/Cu intermetallic interface under thermal aging / Iziana Yahya, Hamidi Abd Hamid and Ramani Mayappan
    Subjects: “...Solder and soldering...”
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    Article
  7. 7
    Damage metric-based thermal cycling guidelines for area-array packages used in harsh thermal conditions
    by Pyland, James
    Published 2007
    Subjects: “...Solder and soldering Reliability...”
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  8. 8
    Observation and modeling of heterogeneous microstructural evolution in Sn-Pb solder
    by Woodmansee, Michael W.
    Published 2007
    Subjects: “...Solder and soldering...”
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  9. 9
    Design of an advanced system for inspection of microelectronic devices and their solder connections using laser-induced virbration techniques
    by Howard, Turner A.
    Published 2007
    Subjects: “...Solder and soldering Quality control...”
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  10. 10
    System implementation, modeling and defects pattern recognition for flip chip solder joint inspection using laser techniques
    by Liu, Sheng
    Published 2007
    Subjects: “...Solder and soldering...”
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  11. 11
    Investigation of electromigration reliability of solder joint in flip-chip packages
    by Ding, Min, 1975-
    Published 2008
    Subjects: “...Solder and soldering...”
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  12. 12
    Comparison of 43Sn/43Pb/14Bi Solder and Standard 60Sn/40Pb Solder by Thermocyclic Fatigue Analysis
    by Calderon, Jose Guadalupe
    Published 1991
    Subjects: “...Solder and soldering....”
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  13. 13
    Fundamentals of solder interconnect wetting
    by Kang, Suk Chae
    Published 2007
    Subjects: “...Solder and soldering...”
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  14. 14
    Flip chip processing of lead-free solders and halogen-free high density microvia substrates
    by Baynham, Grant Andrew
    Published 2008
    Subjects: “...Solder and soldering...”
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  15. 15
    Finite element analysis of printed wiring board deformations during thermal cycles involved in the solder masking process
    by Martin, Timothy Lee
    Published 2007
    Subjects: “...Solder and soldering...”
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  16. 16
    Experimental study of void formation in solder joints of flip-chip assemblies
    by Wang, Daijiao, 1970-
    Published 2008
    Subjects: “...Solder and soldering...”
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    Others
  17. 17
    Thermal cycling and rate-dependent stress relaxation behavior of solders
    by Woodmansee, Michael W.
    Published 2007
    Subjects: “...Solder and soldering Testing...”
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  18. 18
    Implementation of a conformal solder mask system
    by Bolek, Mark Francis
    Published 2014
    Subjects: “...Solder and soldering....”
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    Dissertation
  19. 19
    Fundamentals of area array solder interconnect yield
    by Kim, Chunho
    Published 2007
    Subjects: “...Solder and soldering...”
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  20. 20
    Thermo-mechanical reliability of the VSPA package solder joints
    by Murphy, R. Sean
    Published 2007
    Subjects: “...Solder and soldering Testing...”
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