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Dong-Yurl Yu
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Dong-Yurl Yu
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Dong-Yurl Yu
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1
Enhanced Thermo–Mechanical Reliability of Ultralow-K Dielectrics with Self-Organized Molecular Pores
by
Y.K. Sa
,
Junghwan Bang
,
Junhyuk Son
,
Dong
-
Yurl
Yu
,
Yun-Chan Kim
Published 2021-04-01
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Article
2
Nucleation and Morphology of Cu<sub>6</sub>Sn<sub>5</sub> Intermetallic at the Interface between Molten Sn-0.7Cu-0.2Cr Solder and Cu Substrate
by
Junhyuk Son
,
Dong
-
Yurl
Yu
,
Min-Su Kim
,
Yong-Ho Ko
,
Dong-Jin Byun
,
Junghwan Bang
Published 2021-01-01
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Article
3
Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition
by
Junghwan Bang
,
Dong
-
Yurl
Yu
,
Ming Yang
,
Yong-Ho Ko
,
Jeong-Won Yoon
,
Hiroshi Nishikawa
,
Chang-Woo Lee
Published 2018-07-01
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Article
4
Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate
by
Junhyuk Son
,
Dong
-
Yurl
Yu
,
Yun-Chan Kim
,
Shin-Il Kim
,
Min-Su Kim
,
Dongjin Byun
,
Junghwan Bang
Published 2021-05-01
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Article
5
Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding
by
Gyuwon Jeong
,
Dong
-
Yurl
Yu
,
Seongju Baek
,
Junghwan Bang
,
Tae-Ik Lee
,
Seung-Boo Jung
,
JungSoo Kim
,
Yong-Ho Ko
Published 2021-01-01
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Article
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