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Tae-Ik Lee
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Tae-Ik Lee
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Tae-Ik Lee
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1
Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates
by
Cheolgyu Kim
,
Tae
-
Ik
Lee
,
Min Sung Kim
,
Taek-Soo Kim
Published 2015-06-01
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Article
2
Creation of Curved Nanostructures Using Soft-Materials-Derived Lithography
by
Hyun-Ik Jang
,
Hae-Su Yoon
,
Tae
-
Ik
Lee
,
Sangmin Lee
,
Taek-Soo Kim
,
Jaesool Shim
,
Jae Hong Park
Published 2020-12-01
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Article
3
Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding
by
Gyuwon Jeong
,
Dong-Yurl Yu
,
Seongju Baek
,
Junghwan Bang
,
Tae
-
Ik
Lee
,
Seung-Boo Jung
,
JungSoo Kim
,
Yong-Ho Ko
Published 2021-01-01
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Article
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