EFFECT OF BISMUTH CONTENT ON MICROSTRUCTURE, MELTING TEMPERATURE AND UNDERCOOLING OF SN-0.7CU SOLDER ALLOY

by Mohd Izrul Izwan RAMLI, Muhamad Syafiq Syakri YUSUF, Mohd Arif Anuar MOHD SALLEH
Published 2018-12-01

Effect of Electromigration and Thermal Ageing on the Tin Whiskers’ Formation in Thin Sn–0.7Cu–0.05Ga Lead (Pb)-Free Solder Joints

by Noor Zaimah Mohd Mokhtar, Mohd Arif Anuar Mohd Salleh, Andrei Victor Sandu, Muhammad Mahyiddin Ramli, Jitrin Chaiprapa, Petrica Vizureanu, Mohd Izrul Izwan Ramli
Published 2021-08-01

The Effect of Thermal Annealing on the Microstructure and Mechanical Properties of Sn-0.7Cu-xZn Solder Joint

by Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, Rita Mohd Said, Mohd Mustafa Al Bakri Abdullah, Dewi Suriyani Che Halin, Norainiza Saud, Marcin Nabiałek
Published 2021-02-01

Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing

by Nur Syahirah Mohamad Zaimi, Mohd Arif Anuar Mohd Salleh, Andrei Victor Sandu, Mohd Mustafa Al Bakri Abdullah, Norainiza Saud, Shayfull Zamree Abd Rahim, Petrica Vizureanu, Rita Mohd Said, Mohd Izrul Izwan Ramli
Published 2021-02-01

Microstructure Evolution of Ag/TiO₂ Thin Film

by Dewi Suriyani Che Halin, Kamrosni Abdul Razak, Mohd Arif Anuar Mohd Salleh, Mohd Izrul Izwan Ramli, Mohd Mustafa Al Bakri Abdullah, Ayu Wazira Azhari, Kazuhiro Nogita, Hideyuki Yasuda, Marcin Nabiałek, Jerzy J. Wysłocki
Published 2021-01-01

Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing

by Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, Andrei Victor Sandu, Siti Farahnabilah Muhd Amli, Rita Mohd Said, Norainiza Saud, Mohd Mustafa Al Bakri Abdullah, Petrica Vizureanu, Adam Rylski, Jitrin Chaiprapa, Marcin Nabialek
Published 2021-09-01