DDR4 BER Degradation Due to Crack in FBGA Package Solder Ball
This paper measures bit error rate degradation in DDR4 due to crack in fine pitch ball grid array (FBGA) package solder ball. Thermal coefficient mismatch between the package and printed circuit board material causes cracks to occur in solder balls. These cracks change the electrical model of the so...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-06-01
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| Series: | Electronics |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-9292/10/12/1445 |