Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding

Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding

A drastically growing requirement of electronic packages with an increasing level of complexity poses newer challenges for the competitive manufacturing industry. Coupled with harsher operating conditions, these challenges affirm the need for encapsulated board-level (2nd level) packages. To reduce...

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Bibliographic Details
Main Authors: Romit Kulkarni, Mahdi Soltani, Peter Wappler, Thomas Guenther, Karl-Peter Fritz, Tobias Groezinger, André Zimmermann
Format: Article
Language:English
Published: MDPI AG 2020-03-01
Series:Journal of Manufacturing and Materials Processing
Subjects:
encapsulation
board level package
electronics
epoxy molding compound
flow simulation
injection molding
injection molding simulation
lifetime
manufacturing
pcb
qfn
reliability
resistors
smd
surface mount technology
thermoset
transfer molding
weibull
boxplot
capacitor
cte
material processing
mold trials
scanning acoustic microscopy
temperature shock
Online Access:https://www.mdpi.com/2504-4494/4/1/26

Internet

https://www.mdpi.com/2504-4494/4/1/26

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