Investigating the Effect of Solid Components on Yield Stress for Cemented Paste Backfill via Uniform Design
Cemented paste backfill (CPB) technology has been applied quite popular around the world. Yield stress is a key factor determining whether CPB could be transported. In order to reveal the effect of solid components on yield stress of CPB, a uniform design experimental program (four factors and six l...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Hindawi Limited
2018-01-01
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| Series: | Advances in Materials Science and Engineering |
| Online Access: | http://dx.doi.org/10.1155/2018/3839174 |