Numerical Laplace Inversion Method for Through-Silicon Via (TSV) Noise Coupling in 3D-IC Design
Typical 3D integrated circuit structures based on through-silicon vias (TSVs) are complicated to study and analyze. Therefore, it seems important to find some methods to investigate them. In this paper, a method is proposed to model and compute the time-domain coupling noise in 3D Integrated Circuit...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2019-09-01
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| Series: | Electronics |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-9292/8/9/1010 |