EFFECT OF BISMUTH CONTENT ON MICROSTRUCTURE, MELTING TEMPERATURE AND UNDERCOOLING OF SN-0.7CU SOLDER ALLOY
The aim of this manuscript to study the influence of Bismuth (Bi) addition on the microstructure, melting temperature and undercooling of Sn-0.7Cu solder alloys. In this study, several Bi composition were chosen which is 0 wt.%, 0.25 wt.%, 0.5 wt.%, 1.0 wt.% and 2.0 wt%. The result indicated that wi...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Politehnium Publishing House
2018-12-01
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| Series: | European Journal of Materials Science and Engineering |
| Subjects: | |
| Online Access: | http://ejmse.tuiasi.ro/articles/EJMSE_03_04_06_Ramli.pdf |