Effect of Electromigration and Thermal Ageing on the Tin Whiskers’ Formation in Thin Sn–0.7Cu–0.05Ga Lead (Pb)-Free Solder Joints

Effect of Electromigration and Thermal Ageing on the Tin Whiskers’ Formation in Thin Sn–0.7Cu–0.05Ga Lead (Pb)-Free Solder Joints

The investigation on tin (Sn) whiskers formation has been widely applied in the field of lead-free electronic packaging. This is due to the fact that use of the Sn–Pb finishes has converted to Pb-free finishes in the electronic industry. Sn whiskers can grow long enough to cause a short circuit, whi...

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Bibliographic Details
Main Authors: Noor Zaimah Mohd Mokhtar, Mohd Arif Anuar Mohd Salleh, Andrei Victor Sandu, Muhammad Mahyiddin Ramli, Jitrin Chaiprapa, Petrica Vizureanu, Mohd Izrul Izwan Ramli
Format: Article
Language:English
Published: MDPI AG 2021-08-01
Series:Coatings
Subjects:
gallium
tin whiskers
intermetallic compound
thermal ageing
electromigration
synchrotron micro-XRF
Online Access:https://www.mdpi.com/2079-6412/11/8/935

Internet

https://www.mdpi.com/2079-6412/11/8/935

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