The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints
To analyze the reinforcement effect of adding polymer to solder paste, epoxies were mixed with two currently available Sn-3.0Ag-0.5Cu (wt.% SAC305) and Sn-59Bi (wt.%) solder pastes and specimens prepared by bonding chip resistors to a printed circuit board. The effect of repetitive thermal stress on...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2019-03-01
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| Series: | Materials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1944/12/6/960 |