Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist
This work presents an embedding process for ultrathin silicon chips in mechanically flexible solder mask resist and their electrical contacting by inkjet printing. Photosensitive solder mask resist is applied by conformal spray coating onto epoxy bonded ultrathin chips with a daisy chain layout. The...
Main Authors: | , , , , , |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2021-07-01
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Series: | Micromachines |
Subjects: | |
Online Access: | https://www.mdpi.com/2072-666X/12/8/856 |