Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist

Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist

This work presents an embedding process for ultrathin silicon chips in mechanically flexible solder mask resist and their electrical contacting by inkjet printing. Photosensitive solder mask resist is applied by conformal spray coating onto epoxy bonded ultrathin chips with a daisy chain layout. The...

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Bibliographic Details
Main Authors: Florian Janek, Nadine Eichhorn, Sascha Weser, Kerstin Gläser, Wolfgang Eberhardt, André Zimmermann
Format: Article
Language:English
Published: MDPI AG 2021-07-01
Series:Micromachines
Subjects:
system-in-foil
ultrathin chips
embedding technology
inkjet printing
flexible system
Online Access:https://www.mdpi.com/2072-666X/12/8/856

Internet

https://www.mdpi.com/2072-666X/12/8/856

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