Controlled crack propagation for atomic precision handling of wafer-scale two-dimensional materials

Controlled crack propagation for atomic precision handling of wafer-scale two-dimensional materials

No claim to original U.S. Government Works. Although flakes of two-dimensional (2D) heterostructures at the micrometer scale can be formed with adhesive-tape exfoliation methods, isolation of 2D flakes into monolayers is extremely time consuming because it is a trial-and-error process. Controlling t...

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Main Authors: Nezich, Daniel (Author), Park, Yong Ju (Author), Sundaram, Suresh (Author), Li, Xin (Author), Yue, Ruoyu (Author), Zhou, Guanyu (Author), Ahn, Jong-Hyun (Author), Ougazzaden, Abdallah (Author), Shim, Jaewoo (Contributor), Bae, Sanghoon (Contributor), Kong, Wei (Contributor), Lee, DoYoon (Contributor), Qiao, Kuan (Contributor), Zhao, Ruike (Contributor), Yeon, Hanwool (Contributor), Choi, Chanyeol (Contributor), Kum, Hyunseong (Contributor), Ou, Yunbo (Contributor), Lee, Kyusang (Contributor), Moodera, Jagadeesh (Contributor), Zhao, Xuanhe (Contributor), Hinkle, Christopher W. (Contributor), Kim, Jeehwan (Contributor)
Other Authors: Lincoln Laboratory (Contributor), Massachusetts Institute of Technology. Department of Materials Science and Engineering (Contributor), Massachusetts Institute of Technology. Department of Mechanical Engineering (Contributor), Massachusetts Institute of Technology. Department of Physics (Contributor), Massachusetts Institute of Technology. Microsystems Technology Laboratories (Contributor), Massachusetts Institute of Technology. Plasma Science and Fusion Center (Contributor), Massachusetts Institute of Technology. Research Laboratory of Electronics (Contributor)
Format: Article
Language:English
Published: American Association for the Advancement of Science (AAAS), 2019-01-16T16:55:47Z.
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