Photonic integration in a commercial scaled bulk-CMOS process
We demonstrate the first photonic chip designed for a commercial bulk CMOS process (65 nm-node) using standard process layers combined with post-processing, enabling dense photonic integration with high-performance microprocessor electronics.
Main Authors: | , , , , , , , , , , , , , |
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Other Authors: | , |
Format: | Article |
Language: | English |
Published: |
Institute of Electrical and Electronics Engineers,
2010-12-02T19:38:19Z.
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Subjects: | |
Online Access: | Get fulltext |