Logic characteristics of 40 nm thin-channel InAs HEMTs

We have experimentally investigated the trade-offs involved in thinning down the channel of III-V FETs with the ultimate goal of enhancing the electrostatic integrity and scalability of these devices. To do so, we have fabricated InAs HEMTs with a channel thickness of t[subscript ch] = 5 nm and we h...

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Bibliographic Details
Main Authors: Kim, Tae-Woo (Contributor), Kim, Dae-Hyun (Author), del Alamo, Jesus A. (Contributor)
Other Authors: Massachusetts Institute of Technology. Microsystems Technology Laboratories (Contributor)
Format: Article
Language:English
Published: Institute of Electrical and Electronics Engineers (IEEE), 2012-08-03T15:56:59Z.
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