錫銦銀無鉛銲錫與銅及鎳基材之界面反應研究

碩士 === 國立臺灣大學 === 材料科學與工程學研究所 === 89 === The purpose of this research is to study the interfacial reaction between Sn-In-Ag eutectic lead-free solder and copper or nickel substrate. The reaction temperature is from 225℃to 375℃.There are two intermetallic compounds formed on the copper substrate, whi...

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Bibliographic Details
Main Authors: Kuei-Wei Huang, 黃貴偉
Other Authors: 莊東漢
Format: Others
Language:zh-TW
Published: 2001
Online Access:http://ndltd.ncl.edu.tw/handle/42156013253920036399