錫銦銀無鉛銲錫與銅及鎳基材之界面反應研究

• Main Authors: Kuei-Wei Huang, 黃貴偉
• Other Authors: 莊東漢
• Format: Others
• Language: zh-TW
• Published: 2001
• Online Access: http://ndltd.ncl.edu.tw/handle/42156013253920036399

碩士 === 國立臺灣大學 === 材料科學與工程學研究所 === 89 === The purpose of this research is to study the interfacial reaction between Sn-In-Ag eutectic lead-free solder and copper or nickel substrate. The reaction temperature is from 225℃to 375℃.There are two intermetallic compounds formed on the copper substrate, which are Cu6(Sn,In)5 and Cu3(Sn,In) respectively. At higher temperature, the intermetallic compound changes, and so do the activation energy. However, for the nickel substrate, the composition of the intermetallic compound does not change at low temperature. But both the morphology and the composition of the intermetallic compound change at high temperature.