錫銦銀無鉛銲錫與銅及鎳基材之界面反應研究
碩士 === 國立臺灣大學 === 材料科學與工程學研究所 === 89 === The purpose of this research is to study the interfacial reaction between Sn-In-Ag eutectic lead-free solder and copper or nickel substrate. The reaction temperature is from 225℃to 375℃.There are two intermetallic compounds formed on the copper substrate, whi...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/42156013253920036399 |