Study on the Thermosonic Wire Bonding Process for Chips with Copper Intercon-nects under Inert atmosphere
碩士 === 國立中正大學 === 機械系 === 91 === The first problem we met when packaging Cu chip is that Cu pads oxidize easily, this problem must be overcome so that Au wire can be bonded to Cu pads. In this study, inert shielding gas Ar is applied to protect Cu oxidizing to solve the problem of lower bonding stre...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/40196533803863645190 |