Thermal Cycling Life of QFN Package Assembly
碩士 === 長庚大學 === 機械工程研究所 === 91 === The problem of thermal cycling life of a quad flat non-lead (QFN) package assembly is investigated experimentally and numerically. Prior to assembly problem, the thermally—induced deformations of a QFN package was studied with Twymen-Green interferometry measuremen...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/21539748691728004303 |