Study on Electromigration of Flip-Chip Solder Interconnect
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 92 === As the trend of miniaturization of complex integrated circuit(IC) devices, the current density of flip-chip solder bumps have increased significantly and each solder joint is supporting a current density close to or even over 104 A/cm2 .Therefore, in SnPb eu...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/60304611680142508254 |