Interfacial Reactions of Sn-Zn, Sn-Zn-Al, and Sn-Zn-Bi Solder Balls with Au/Ni Pad in BGA Package
碩士 === 國立中山大學 === 材料科學研究所 === 93 === The interfacial reactions of Sn-Zn and Sn-Zn-Al solder balls with Au/Ni surface finish under aging at 150℃ were investigated. With microstructure evolution, quantitative analysis, elemental distribution by X-ray color mapping from an electron probe microanalyzer...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/52115737848689416418 |